Proactive Design for eXcellence process for High Speed Boards.
Purpose
Printed Wiring Boards used for High Speed Electronic Packaging are building blocks for high performance Communication equipment, are often product of contradicting performance requirements.
Implementation of a particular design requirement will have a direct impact on other related product performance parameters.
Electronic
Product Packaging Steps are:
List mentioned here
in but not entirely limited to:
o
Determining Interconnection levels.
o
Product life cycle management.
o
Relevance to technology roadmaps.
o
Advanced Packaging drivers.
o
Material and assembly cost drivers
o
Dfx Process
The list is endless,
so at any given time a new meaningful Design requirement can make it to the prolonged
process of design-review-redesign,
However any design
reviews are intended towards
a. Successful
design of PWB
b. Automated
assembly of the PWB
c. Performance
of the finished PWB in the functional environment.
d. Failure
prevention, reliability
Though fixing review
errors are multi disciplinary tasks.
Interconnecting
and Packaging industry takes on Design for Process:
Industry fixed the design review process by introducing
automated evaluation procedures, and many EDA
vendors have built in DfX within CAD environment.
Certain DfX Checks are done online within CAD environment and fixed as and when it occurs.
However Design For Fabrication Checks are done by
PCB CAM tools, and
Design For Assembly Checks are done by Assembly EMS
process specialists.
The Checks are
done to evaluate :
Manufacturing Equipment compatibility, Steps to optimize
process, recognize show-stoppers early, test ability, and design compatibility to
enhance chances of “ build anywhere” trends.
Industry bodies like ITRS2, IPC and Inemi have
published a lot of roadmaps, and process steps to aid DfX Process.
The roadmaps suggest ever evolving Advanced
Packaging drivers.
Which include packaging cost, test cost,
Tighter System integration with shorted signal
interconnection runs.
Ever increasing operating frequencies, which in turn
call for severe constraints on signal integrity, power integrity and thermal
budgets.
Also it is an industry observation that Moore’s law
which was a guiding bellwether for Silicon Scaling is slowing down, but a
highly inter discipline dependent packaging scale which is predominantly
integration oriented, has emerged, and aptly called as “More than Moore”.
With More than Moore key focus is on system
interconnection, integration
and assembly realization.
The issues which were earlier deemed as purely
electrical or functional in
Nature will manifest as multi-physics in implementation.
It is prudent that these checks are done early in
the design, as errors caught at earlier
stage of the design are less costlier compared to when caught at later stages
of the product design.
The errors shall be fixed by concurrent approval of
all stake holders like designers, board fabricators, and assembly houses to arrive at a workable process plan to
address errors reported.
An early interdisciplinary review results in:
• Faster Product development pace.
• End product immune to surprises,
arising out of yield dips.
• DfX Process is one of the key
tools available to keep in tune with
technology development.
• Automated DfX exchange is
executed as a key enabler in product
Yield improvements
• Scope to Plough back findings
into design constraints.
Thus IPC is ready with CFX (Connected Factory Exchange), which
incorporates various review procedures of Design implementation, and technology
transfer procedures.
Both standard and education programmes shall be
available by the time the reader finishes assimilating gist of this article.
Let’s put our new designs through early Dfx checks
and be ready to manufacture Electronic Products under IPC CFX.
Reference:
- IPC India Apex 2016, held in Bangalore 21-23 SEP 2016.
- www.ipc-cfx.org
Mr. Amba Prasad, Product Architect, R&D, Tejas Networks
Ltd.
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